SPI Flash Chip - Winbond(W25X10, W25X20, W25X40, W25X80) Command List

Winbond(W25X10, W25X20, W25X40, W25X80) Instruction Set

INSTRUCTION NAME	BYTE 1 CODE	BYTE 2	BYTE 3	BYTE 4	BYTE 5	BYTE 6	N-BYTES
Write Enable	06h
Write Disable	04h
Read Status Register	05h
Write Status Register	01h
Read Data	03h	A23–A16	A15–A8	A7–A0	(D7–D0)	(Next byte)	continuous
Fast Read	0Bh	A23–A16	A15–A8	A7–A0	dummy	(D7–D0)	(Next Byte) continuous
Fast Read Dual Output	3Bh	A23–A16	A15–A8	A7–A0	dummy	I/O = (D6,D4,D2,D0) O = (D7,D5,D3,D1)	(one byte per 4 clocks, continuous)
Page Program	02h	A23–A16	A15–A8	A7–A0	(D7–D0)	(Next byte)	Up to 256 bytes
Block Erase (64KB)	D8h	A23–A16	A15–A8	A7–A0
Sector Erase (4KB)	20h	A23–A16	A15–A8	A7–A0
Chip Erase	C7h
Power-down	B9h
Release Power- down / Device ID	ABh	dummy	dummy	dummy	(ID7-ID0)
Manufacturer/ Device ID	90h	dummy	dummy	00h	(M7-M0)	(ID7-ID0)
JEDEC ID	9Fh	(M7-M0) Manufacturer	(ID15-ID8) Memory Type	(ID7-ID0) Capacity

Notes:

1.            Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “( )” indicate data being read from the device on the DO pin.

2.            The Status Register contents will repeat continuously until /CS terminates the instruction.

3.            See Manufacturer and Device Identification table for Device ID information.

4.            The Device ID will repeat continuously until /CS terminates the instruction.

Status Register

Bit	Name	Description
7	SRP	Status Register Protect(NON-VOLATILE)
6	R	Reserved
5	TB	Top/Bottom Block Protect
4:2	BP2:0	Block Protect Bits (BP2, BP1, BP0)
1	WEL	Write Enable Latch
0	BUSY	Busy Status

Manufacturer and Device Identification

MANUFACTURER ID	(M7-M0)
Winbond Serial Flash	EFH
Device ID	(ID7-ID0)	(ID15-ID0)
Instruction	ABh, 90h	9Fh
W25X10	10h	3011h
W25X20	11h	3012h
W25X40	12h	3013h
W25X80	13h	3014h