SPI Flash Chip - Winbond(W25Q80, W25Q16, W25Q32) Command List

Winbond(W25Q80, W25Q16, W25Q32)

FEATURES

• Family of SpiFlash Memories

– W25Q80: 8M-bit / 1M -byte (1,048,576)

– W25Q16: 16M-bit / 2M-byte (2,097,152)

– W25Q32: 32M-bit / 4M-byte (4,194,304)

– 256-bytes per programmable page

• Standard, Dual or Quad SPI

– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold

– Dual SPI: CLK, /CS, IO 0 , IO 1 , /WP, /Hold

– Quad SPI: CLK, /CS, IO 0 , IO 1 , IO 2 , IO 3

• Highest Performance Serial Flash  

– Up to 6X that of ordinary Serial Flash

– 80MHz clock operation

– 160MHz equivalent Dual SPI

– 320MHz equivalent Quad SPI

– 40MB/S continuous data transfer rate

– 30MB/S random access (32-byte fetch)

– Comparable to X16 Parallel Flash

• Low Power, Wide Temperature Range  

– Single 2.7 to 3.6V supply

– 4mA active current, 〈1 data-blogger-escaped-o：p=“o：p” data-blogger-escaped-power-down=“power-down”data-blogger-escaped-typ.=“typ.”〉

– -40°C to +85°C operating range

• Flexible Architecture with 4KB sectors

– Uniform Sector Erase (4K-bytes)

– Block Erase (32K and 64K-bytes)

– Program one to 256 bytes

– Up to 100,000 erase/write cycles

– 20-year data retention

• Advanced Security Features

– Software and Hardware Write-Protect

– Top or Bottom, Sector or Block selection

– Lock-Down and OTP protection

– 64-Bit Unique ID for each device

Note 1:

These features are on special order.

Please contact Winbond for details.

• Space Efficient Packaging

– 8-pin SOIC 208-mil  

– 8-pad WSON 6x5-mm (W25Q80 & W25Q16)

–16-pin SOIC 300-mil (W25Q16 & W25Q32)

Instruction Set Table

INSTRUCTION NAME	BYTE 1 CODE	BYTE 2	BYTE 3	BYTE 4	BYTE 5	BYTE 6	N-BYTES
Write Enable	06h
Write Disable	04h
Read Status Register-1	05h	(S7–S0) (2)
Read Status Register-2	35h	(S15-S8) (2)
Write Status Register	01h	(S7–S0)	(S15-S8)
Page Program	02h	A23–A16	A15–A8	A7–A0	(D7–D0)	(Next byte)	Up to 256 bytes
Quad Page Program	32h	A23–A16	A15–A8	A7–A0	(D7–D0)
Block Erase (64KB)	D8h	A23–A16	A15–A8	A7–A0
Block Erase (32KB)	52h	A23–A16	A15–A8	A7–A0
Sector Erase (4KB)	20h	A23–A16	A15–A8	A7–A0
Chip Erase	C7h/60h
Erase Suspend	75h
Erase Resume	94h
Power-down	B9h
High Performance Mode	A3h	dummy	dummy	dummy
Mode Bit Reset (4)	FFh	FFh
Release Power-down / Device ID	ABh	dummy	dummy	dummy	(ID7-ID0)(5)
Manufacturer/ Device ID	90h	dummy	dummy	00h	(M7-M0)	(ID7-ID0)
Read Unique ID(7)	4Bh	dummy	dummy	dummy	dummy	(ID63-ID0)
JEDEC ID	9Fh	(M7-M0) Manufacturer	(ID15-ID8) Memory Type	(ID7-ID0) Capacity
Read Data	03h	A23–A16	A15–A8	A7–A0	(D7–D0)	(Next byte)	continuous
Fast Read	0Bh	A23–A16	A15–A8	A7–A0	dummy	(D7–D0)	(Next Byte) continuous
Fast Read Dual Output	3Bh	A23–A16	A15–A8	A7–A0	dummy	I/O = (D6,D4,D2,D0) O = (D7,D5,D3,D1)	(one byte per 4 clocks, continuous)
Fast Read Dual Output	3Bh	A23–A16	A15–A8	A7–A0	dummy	(D7–D0, …)(8)
Fast Read Dual I/O	BBh	A23-A8(2)	A7-A0, M7-M0(9)	(D7–D0, …)(1)
Fast Read Quad Output	6Bh	A23–A16	A15–A8	A7–A0	dummy	(D7–D0, …)(10)
Fast Read Quad I/O	EBh	A23-A0, M7-M0(4)	(x,x,x,x, D7–D0, …)(12)	(D7-D0, …)(10)

Notes:
1. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “()” indicate data being read from the device on the DO pin.

2. The Status Register contents will repeat continuously until /CS terminates the instruction.

3. Quad Page Program Input Data
IO0 = (D4, D0, ...)
IO1 = (D5, D1, ...)
IO2 = (D6, D2, ...)
IO3 = (D7, D3, ...)

4. This instruction is recommended when using the Dual or Quad Mode bit feature. See section 10.2.28 for more information.

5. The Device ID will repeat continuously until /CS terminates the instruction.

6. See Manufacturer and Device Identification table for Device ID information.

7. This feature is available upon special order. Please contact Winbond for details.

8. Dual Output data  
IO0 = (D6, D4, D2, D0)
IO1 = (D7, D5, D3, D1)

9. Dual Input Address
IO0 = A22, A20, A18, A16, A14, A12, A10, A8    A6, A4, A2, A0, M6, M4, M2, M0  
IO1 = A23, A21, A19, A17, A15, A13, A11, A9    A7, A5, A3, A1, M7, M5, M3, M1

10. Quad Output Data
IO0 = (D4, D0, ...)
IO1 = (D5, D1, ...)
IO2 = (D6, D2, ...)
IO3 = (D7, D3, ...)

11. Quad Input Address
IO0 = A20, A16, A12, A8 , A4, A0, M4, M0
IO1 = A21, A17, A13, A9 , A5, A1, M5, M1
IO2 = A22, A18, A14, A10, A6, A2, M6, M2
IO3 = A23, A19, A15, A11, A7, A3, M7, M3

12. Fast Read Quad I/O Data  
IO0 = (x, x, x, x, D4, D0, ...)
IO1 = (x, x, x, x, D5, D1, ...)
IO2 = (x, x, x, x, D6, D2, ...)
IO3 = (x, x, x, x, D7, D3, ...)

Status Register-1

Bit	Name	Description
S7	SRP	Status Register Protect(NON-VOLATILE)
S6	SEC	Sector Protect(NON-VOLITILE)
S5	TB	Top/Bottom Block Protect
S4:2	BP2:0	Block Protect Bits (BP2, BP1, BP0)
S1	WEL	Write Enable Latch
S0	BUSY	Busy Status

Status Register-2

Bit	Name	Description
S15	R	Reserved
S14	R	Reserved
S13	R	Reserved
S12	R	Reserved
S11	R	Reserved
S10	R	Reserved
S9	QE	Quad Enable(NON-VOLITILE)
S8	SRP1	Status Register Protect1(NON-VOLITILE)

Manufacturer and Device Identification

MANUFACTURER ID	(M7-M0)
Winbond Serial Flash	EFH
Device ID	(ID7-ID0)	(ID15-ID0)
Instruction	ABh, 90h	9Fh
W25Q80	13h	4014h
W25Q16	14h	4015h
W25Q32	15h	4016h